Linha de pulverização NCVM com solução PVD para eletrônica 3C
This specialized solution deposits discontinuous metal islands onto plastic substrates, creating a metallic appearance while allowing RF signals to pass through unimpeded. The process involves spraying a specialized UV primer, performing PVD with NCVM-compatible targets, and applying a UV topcoat. It is essential for smartphone cases, antenna housings, and medical devices where electromagnetic compatibility is mandatory.
5 considerações críticas para sua solução:
1. Primer Outgassing: Minimize to prevent chamber contamination.
2. Target Composition: Control non-conductive properties via target alloys.
3. Topcoat AF Layer: Enhance user experience with anti-fingerprint properties.
4. Film Thickness: Maintain 8–12 μm for optimal signal penetration.
5. Color Consistency: Achieve Delta E < 1.0 for brand identity.
Geetech (Dongguan Geetech Electrical-Mechanical Equipment Co., Ltd.) provides NCVM-ready 5-axis lines with precise chamber bias control. Our process engineering ensures your parts meet both aesthetic and functional requirements, validated through rigorous signal attenuation and adhesion testing.
Por que escolher a solução Geetech:
1. Tailored NCVM recipes for specific substrate and signal needs.
2. Integrated AF coating options for premium tactile feel.
3. High-precision servo drives maintain film uniformity on 3D parts.
4. Comprehensive testing protocols (signal, adhesion, gloss) included.
5. Direct factory support from our Dongguan engineering team.